DOWSIL™ TC-6015 Thermal Conductive Encapsulant

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DOWSIL™ TC-6015 is two part, room temperature curable and heat fast cure, self-adhesion, low specific gravity thermal conductive encapsulant. Developed to meet the demand across industries including renewable energy, energy storage,…


  • PV Inverter
  • Energy Storage System
  • Automotive control unit/EV module
  • High-power modules


  • Thermal conductivity 1.6W/m·K
    Low density
    High flowability/rheology control
    Minimal filler settling and no hard caking
    Room Temperature curable with accelerated heat option
    Excellent flame retardancy UL 94 V-0; RTI 150 °C
    High reliability performance


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