Thermally Conductive Materials

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  DOWSIL™ TC-6015 Thermal Conductive Encapsulant

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  Dow Corning® TC-4015 Dispensable Thermal Pad

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  BERGQUIST® GAP FILLER TGF 1450 – Thermal Adhesives

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  BERGQUIST® GAP FILLER TGF 1500

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  Loctite TG100 Thermal Greases

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  Dow Corning® TC-5080 Thermally Conductive Compound

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  Dow Corning® 340 Heat Sink Compound

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  Dow Corning® 3-6752 Thermally Conductive Adhesive

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• 

  SYLGARD 160 Silicone Elastomer Encapsulant

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• 

  Bergquist Silpad 400 – Henkel Thermal Adhesives

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  Bergquist Bond Ply TBO 850 Thermally Conductive

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