Loctite 3609

Loctite 3609

Chipbonder

Loctite 3609 is used for medium to high speed dispense applications. Excellent green strength for large components. Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Loctite 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.

Chemical Type Epoxy
Appearance (uncured) Dark, red viscous gel
Components One component – requires no mixing
Cure Heat cure
Application Surface mount adhesive
Key Substrates SMD components to PCB
Other Application Areas Small parts bonding
Dispense Method Syringe
Dispense Speed Medium 15,000 -25,000 dots/h
Wet Strength High

Typical curing performance

Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C).

Download documents

tds
Technical Data Sheet