Description
Chipbonder
Loctite 3609 is used for medium to high speed dispense applications. Excellent green strength for large components. Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Loctite 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
| Chemical Type | Epoxy |
| Appearance (uncured) | Dark, red viscous gel |
| Components | One component – requires no mixing |
| Cure | Heat cure |
| Application | Surface mount adhesive |
| Key Substrates | SMD components to PCB |
| Other Application Areas | Small parts bonding |
| Dispense Method | Syringe |
| Dispense Speed | Medium 15,000 -25,000 dots/h |
| Wet Strength | High |
Typical curing performance
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C).
