Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system
Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.
The Jade Prodex is an offline system, incorporating a quick load, twin PCB, universally adjustable, rotary table transport system to allow simultaneous load/unload during product processing.
As standard, the Jade Prodex is configured with our Duplex twin solder bath arrangement. On independent Z axis drives, this achieves increased production flexibility by permitting the use of two different nozzle tip sizes, which can be allocated as process requirements dictate within any particular area on a PCB.
The Prodex series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.
Additionally, our optional PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.
- DC servo drives
- Rotary indexing table with twin adjustable positions
- Integral PC and machine mounted monitor
- Twin solder bath capability on independent Z axis
- Inerted Nitrogen system
- Internal fume extraction
- Titanium Drop-Jet fluxer
- Universally adjustable tooling carrier
- Auto motorised wire solder feed & level detect
- Solder bath coding – identifies correct bath for program
- Solder wave height measurement and correction
- Set of AP style solder nozzle tips
- Thermal nozzle calibration system using integrated setting camera
- Auto-nozzle conditioning system
- Manual fiducial correction system
- Colour programming camera
- Process viewing camera(s)
- Multilevel password protection
- Light stack
- PillarCOMM Windows® based ‘Point & Click’ interface
- PillarPAD offline programming system
- Lead-free compatible
- Day-to-day service kit
- Flux presence sensor – thermistor style
- Flux spray, flow and spray & flow
- Pump rpm
- O2 ppm
- Nitrogen flow
- Top-side instant IR preheat
- Bottom-side slide in / out instant IR preheat
- Closed loop pyrometer temperature control
- Bottom-side hot Nitrogen selective preheat
- Automatic fiducial correction
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Laser PCB warp correction
- Micro nozzle assembly
- Large solder bath for dedicated single dip applications
- Solder bath removal trolley
- Solder reel identification
- Larger PCB handling size
- Nitrogen generator
- Height: 1208mm / 47.5” to 2025mm / 80”- with light stack
- Width: 1250mm / 49“ to 1460mm / 57”- with rotate
- Depth: 2020mm / 79.5”
2240mm /88” with flux bottles
- Board size: 457mm x 508mm / 18”x 20”
- Edge clearance: Above/below 3mm
- Height clearance: Above/below 40mm nominal
70mm max. top-side only
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 20kg standard – 30kg large bath
- Applicators: AP style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 20mm dia.
Micro nozzle – 1.5mm to 2.5mm
Jet-Tip style – 6mm to 40mm dia.
Jet-Wave nozzle – up to 25mm width
Special dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available
- X, Y & Z Axis resolution: 0.1mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
- Nitrogen purity: 99.995% or better
- Power supplies: Three phase + neutral + PE
- Voltage: 230 V phase to neutral / 400V phase to phase
- Frequency: 50/60Hz
- Power : Maximum 9kVA per phase machine configuration dependent
- Transport: Hand load
- Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
- Programming: PillarCOMM Windows® based ‘Point & Click’ interface