Pillarhouse Orissa Synchrodex – Selective Soldering – In-Line

Listed price may vary by MOQ. Please contact us for the best price.


Flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed together.

Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side pre-heat function. Pre-heat can be controlled via an optional top side closed-loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology – single point AP nozzle design – incorporating patented spiral solder return to bath technology, offering increased wave stability with reduced potential for solder balls.

The system can also accommodate our latest generation micronozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and assists in the prevention of oxidation. This process provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Synchrodex is controlled by a PC, through PillarCOMMX, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

  • In-line motor driven auto width adjust through feed synchronous movement conveyor
  • Conveyor side clamping
  • Integral PC and machine mounted monitor
  • Motorised auto-solder top-up (wire feed) & solder level detect
  • Heated inerted Nitrogen system
  • Titanium Drop-Jet fluxer
  • Set of AP solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Solder wave height measurement and correction
  • Pump rpm
  • Auto-nozzle conditioning system
  • Thermal nozzle calibration system using integrated setting camera
  • Windows® based PillarCOMM ‘Point & Click’ interface
  • Light stack
  • Auto fiducial recognition and correction system
  • Flux level sensor
  • Multiple level password protection
  • PillarPAD offline programming system
  • SMEMA compatible
  • Process viewing camera with record feature
  • Lead-free capability
  • Day-to-day service kit

Monitoring Options

  • Flux presence sensor – thermistor style
  • Flux spray, flow and spray & flow
  • O2 ppm
  • Nitrogen flow

System Options

  • Ultrasonic fluxing
  • Dual Drop-Jet / ultrasonic fluxing
  • Top-side instant IR preheat
  • Closed loop pyrometer temperature control
  • Bottom-side hot Nitrogen selective preheat
  • Laser PCB warp correction
  • Solder reel identification
  • Solder bath coding – identifies correct bath for program
  • Encoders on X, Y and Z axis
  • Nitrogen generator


  • Height: 1615mm / 63” – excluding light stack
  • Width: 813mm / 32“
  • Depth: 2024mm / 80”
  • Board size: Max. – 457mm x 610mm / 18”x 24”
    Min. – 102mm x 102mm / 4”x 4”
  • Edge clearance: Above/below 3mm
  • Height clearance: Below 40mm – above 45mm
    100mm – upon request
  • Extraction: Fan: 276mm dia.
  • Rating: 1000m3/hr / 589 CFM
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 15kg standard – 25kg large bath
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    150mm Wave nozzle
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • Flux tank capacity: 1 litre
  • Fluxer speed: 50 dots/second
  • Deposition size: 4.0-6.0mm / 0.16-0.24”
  • X, Y & Z axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen supply pressure: 5 bar / 72 psi
  • Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Air usage: 10 litres/min. / 0.35 CFM
  • Power Supplies: Single phase + PE
  • Voltage: 230V
  • Frequency: 50/60Hz
  • Power: 10.5kVA max. – machine configuration dependent
  • Transport: Conveyor


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