Loctite Eccobond UF 3810

Listed price may vary by MOQ. Please contact us for the best price.


LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications.

  • High Tg
  • Fast cure at moderate temperatures
  • Halogen free
  • Compatible with most Pb-free solders
  • Stable electrical performance in temperature humidity bias
  • Reworkable
  • Room temperature flow capability
Scroll to top