DOWSIL™ TC-6015 Thermal Conductive Encapsulant

Description

DOWSIL™ TC-6015 is two part, room temperature curable and heat fast cure, self-adhesion, low specific gravity thermal conductive encapsulant. Developed to meet the demand across industries including renewable energy, energy storage,…

Uses

• PV Inverter
• Energy Storage System
• Automotive control unit/EV module
• High-power modules

Benefits

• Thermal conductivity 1.6W/m·K
  Low density
  High flowability/rheology control
  Minimal filler settling and no hard caking
  Room Temperature curable with accelerated heat option
  Self-adhesion
  Excellent flame retardancy UL 94 V-0; RTI 150 °C
  High reliability performance