Description
n
n
n
Silicone for semiconductor, die attach / lid seal, microelectronic adhesive; Dow corning® DA 6501 are designed to meet key criteria inthe micro- and optoelectronic packaging industry; including high purity, moisture resistance and thermal and electrical stability; suited for microelectronic devices requiring low-modulus materials, for lead-free solder reflow temperatures (260°C), or other high-reliability applications. One-part materials, translucent, heat cure, flowable, long working time.
n
Highly stress relieving. Automated or manual needle dispenser.
n
| Color | Translucent |
| Physical Form: | Liquid |
| Dielectric Constant at 1MHz | = 2.8 |
| Dielectric Strength | = 625 volts per mil v/mil |
| Durometer – Shore A | = 31 Shore A |
| Linear CTE | = 300 um/m/Deg C |
| Shear | = 80 psi |
| Viscosity | = 7300 mPa.s |
| Volume Resistivity | = 2.7e+016 ohm-centimeters |
| Young’s Modulus | = 130 psi |
n
n
n
n
Categories
n
| Products: | Silicone Adhesive / Sealant |
| Supplier: | Dow Corning (brand) |
| Industrial applications: | Electronics Assembly |
n This
nn
