Dow Corning® 340 Heat Sink Compound

White, non-flowing, highly filled compound, good thermal conductivity

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Dow Corning® 340 Heat Sink Compound is thermal coupling of electrical/electronic devices to heat sinks. High thermal conductivity; low bleed; stable at high temperatures.

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Primary Use: Thermal coupling of electrical/electronic devices to heat sinks.

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Physical Form: White, grease-like silicone heavily filled with heat-conductive metal oxides.

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Temperature Range: From -40 to 390°F (-40 to 199°C).

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Application: Applied to the base and mounting studs of transistors, diodes and siliconcontrolled rectifiers; thermal coupler for many heat sink devices; high-voltage coronasuppressant; nonflammable coating in flyback transformer connections in TV sets.

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Container Sizes: Tubes, cartridges, pails and drums.

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