BERGQUIST® GAP FILLER TGF 1450 – Thermal Adhesives

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Description

BERGQUIST GAP FILLER TGF 1450 is a two-part liquid gap filling system that cures at room temperature to form a strong, mouldable elastomer that is ideal for fragile assemblies.

BERGQUIST® GAP FILLER TGF 1450 is a liquid gap filling material that provides a high level of control due to its high shear thinning characteristics and dries with a low density to reduce final assembly weight. The mixed system remains ultra-conforming with excellent wet-out for near zero interface stress and offers infinite thickness variations without adding stress to the sensitive components during or following assembly.

  • Thermal conductivity: 1.5 W/m-K
  • No cure by-products
  • Ultra-conforming with excellent wet-out for near zero interface stress
  • Low density for weight sensitive application
Density 1.85 g/cm³
Dielectric Constant, ASTM D150 @ 1kHz 6.4
Flame Rating V-0
Heat Capacity, ASTM E1269 1.0 J/g-K
Mix Ratio, by Volume 1 : 1
Mix Ratio, by Weight 1 : 1
Pot Life, @ 25.0 °C 60.0 min.
Shelf Life 6.0 mon.
Shore Hardness, Thirty second delay value, ASTM D2240 Shore 00 40.0
Storage Temperature 25.0 °C
Thermal Conductivity 1.5 W/mK
Volume Resistivity 1×10 Ohm m
Resin
Color, Resin Blue
Hardener
Color, Hardener Blue: Light Blue
BERGQUIST® GAP FILLER TGF 1450 – Thermal Adhesives
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