loctite-eccobond-uf-3810

loctite-eccobond-uf-3810

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Henkel's innovative capillary flow underfills for CSP, BGA, WLCSP, LGA and other similar devices lower stress, improve reliability and offer outstanding processability. HENKEL UNDERFILL Henkel’s LOCTITE ECCOBOND and LOCTITE underfills offer the highest levels of reliability with the options of both reworkable and non-reworkable formulations.  Fast flow speeds, fill effectively bottom-side component spaces. Formulations designed…
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