Henkel brand’s Bergquist thermal conductive liquid product is specifically designed to support and optimize the dispensing process, making heat dissipation better. Prepared in liquid form, these materials almost do not create any pressure on parts during assembly. The product can be used to contact and adapt to the most complex terrain – surfaces. They provide uneven surfaces with a thick coating.
In this article, Creative Engineering will present three of the best Gap Filler thermal products in the market today!
1. BERGQUIST® GAP FILLER TGF 1500
BERGQUIST® GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly.
BERGQUIST GAP FILLER TGF 1500 exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required. As cured, BERQUIST GAP FILLER TGF 1500 provides a soft, thermally conductive, form-in-place elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.
– Thermal conductivity: 1.8 W/mK
– Optimized shear thinning characteristics for ease of dispensing
– Excellent slump resistance (stays in place)
– Ultra-conforming with excellent wet-out for low stress interface applications
– 100% solids – no cure by-products
– Excellent low and high temperature mechanical and chemical stability
2. GAP FILLER 3500LV
With designs becoming increasingly small and intricate, adequate material coverage for effective thermal control is more challenging than ever before. GAP FILLER 3500LV is the solution. A two-part, liquid-dispensed material, GAP FILLER 3500LV provides high thermal conductivity of 3.5W/m-K and all the mechanical properties of a silicone without the outgassing concerns. Because it’s a liquid, GAP FILLER 3500LV can fill tiny gaps and flow around complex architectures to ensure good thermal transfer and long-term product reliability.
– Thermal conductivity of 3.5W/m-K
– Minimal outgassing characteristic ideal for applications where optics must remain free of lens fogging and for environments where silicone sensitivity is a concern
– Flexible cure schedule with curing at room temperature or accelerated with the addition of heat
– Soft after curing for protection from shock and vibration
– Exceptional void filling for maximum thermal performance
– Ideal for high-volume manufacturing where automation is a necessity
3. BERGQUIST GAP FILLER TGF 1450
BERGQUIST® GAP FILLER TGF 1450 is a high performance thermally conductive liquid gap filling material which features high shear thinning characteristics for optimized consistency and control during dispensing. BERGQUIST GAP FILLER TGF 1450 features a low-density design which reduces final assembly weight. The mixed system will cure at room temperature and can be accelerated with the addition of heat. BERGQUIST GAP FILLER TGF 1450 offers infinite thickness variations with little or no stress to the sensitive components during or following assembly.
– Thermal conductivity: 1.5 W/m-K
– Ultra-conforming with excellent wet-out for near zero interface stress
– No cure by-products
– Low density for weight sensitive application
– Excellent low and high temperature mechanical and chemical stability
– Shear thinning viscosity for ease of dispensing
Catching up with the trend of highly thermal demands in electronics industry, Creative Engineering offers customers the best thermal solutions from the Bergquist – Henkel brand. Contact us for more !