tesa® HAF 8414 is a translucent heat activated adhesive film that contains electrically conductive particles.
- Chip module bonding and electrical connectivity in one step
- Good workability on all common implanting lines
- Suitable for PVC, ABS and PC cards (Dual Interface (D.I.) and contactless cards)
- Suitable for silver ink substrates and wire antenna
Mean particle diameter: 40 µm
Tesa® HAF 8414 is designed for all applications where reliable electrical connections and strong bonds are required. Lead applications are chip module embedding in Dual Interface (DI) cards and for RFID tags.
|Type of adhesive||copolyamide|
|Type of liner||glassine|