Supplier: Technomelt

Henkel’s renowned TECHNOMELT® low pressure molding solution delivers superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: The entire TECHNOMELT® operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications, and Henkel provides manufacturers with proven, reliable solutions and peace of mind.

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