Loctite 3621

Loctite 3621

Chipbonder

Henkel Loctite 3621 is a high performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet. Superior humidity resistance and electrical properties. Room temperature storage capable.

LOCTITE 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free wave solder processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section

LOCTITE 3621 is supplied de-aerated in a range of ready-to-use syringes which fit straight into a variety of air pressure/time dispensing systems commonly available.

Chemical Type Epoxy
Appearance (uncured) Red viscous gel (LMS)
Components One component -requires no mixing
Cure Heat cure
Application Surface mount adhesive
Key Substrates SMD components to PCB
Other Application Areas Small parts bonding
Dispense Method Syringe
Dispense Speed Very high 25,000 – 50,000 dots/h
Wet Strength High

Download documents

tds
Loctite 3621 Technical Data Sheet (English document)