Loctite 3619

Loctite 3619


Loctite 3619 is used for ultra low temperature cure, high speed syringe dispense. For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.

Loctite 3619 the following characteristics:

Appearance (uncured): Red high viscosity paste
Components: One component – requires no mixing
Cure: Heat cure
Key Substrates: SMD components to PCB
Dispense Method: Syringe

Download documents

Loctite 3619 Technical Data Sheets (English)