Dow Corning® 340 Heat Sink Compound is thermal coupling of electrical/electronic devices to heat sinks. High thermal conductivity; low bleed; stable at high temperatures.
Primary Use: Thermal coupling of electrical/electronic devices to heat sinks.
Physical Form: White, grease-like silicone heavily filled with heat-conductive metal oxides.
Temperature Range: From -40 to 390°F (-40 to 199°C).
Application: Applied to the base and mounting studs of transistors, diodes and siliconcontrolled rectifiers; thermal coupler for many heat sink devices; high-voltage coronasuppressant; nonflammable coating in flyback transformer connections in TV sets.
Container Sizes: Tubes, cartridges, pails and drums.
|Shelf Life||= 1800 Days|
|Specific Gravity @ 25C||= 2.1|
|Thermal Conductivity||= 0.67 Watts per meter K|
|Thickening System||Metal Oxide|
|Viscosity||= 542000 mPa.s|
|Worked Penetration||= 290 mm/10|